Thermal Stability of Wood‐Wood and Wood‐FRP Bonding with Polyurethane and Epoxy Adhesives
Abstract
The performance of PUR and EP adhesives in wood bonds at increased temperatures is discussed. DTMA and mechanical tests show that glue‐line thickness and adhesive formulation are decisive for PUR‐bond safety, confirming that any application must be restricted to close contact joints. EP adhesives show strength reductions at temperatures above 60 °C. Up to this temperature high viscous adhesives/modifications perform better than low viscous products. As for PUR, only some products had sufficient strength and stiffness above 70 °C. Best‐adapted adhesives for a specific application must be selected in function of the expected temperature range in service.
Reference
K. Richter; R. Steiger. (2005). Thermal Stability of Wood‐Wood and Wood‐FRP Bonding with Polyurethane and Epoxy Adhesives. Advanced Engineering Materials. https://doi.org/10.1002/adem.200500062
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